300mm硅片平坦化,材料基因组
leizhu@mail.sim.ac.cn
个人履历
朱雷,现任中国科学院上海微系统与信息技术研究所高级工程师、硕士生导师。2018年博士毕业于中科院上海微系统所,获批中科院特聘研究岗、嘉定区紧缺人才、长宁区青年创新个人称号,作为团队成员获中科院科技促进发展奖。读博期间研究面向5G射频应用的RFSOI材料,实现射频SOI衬底量产成套工艺开发。2019年参与策划集成电路材料基因组交叉方向,作为核心成员组建高通量实验、材料计算、数据库和人工智能等平台,成功研制出具有独立自主知识产权的全晶圆高通量PVD-ALD-XPS集簇设备实现单片多组分薄膜隔离沉积,部署集成电路材料专用数据库支持电子笔记本、数据分析和人工智能建模功能,结合材料高通量计算和高通量实验研究筛选出高压电常数、低损耗的5G射频压电材料;利用有限元模拟、分子动力学计算、实验、人工智能结合,构建抛光材料-抛光工艺-抛光后效果之间构效关系,实现300mm硅片抛光工艺材料设计等。
近年来连续承担或参与科技部重点研发计划、科技部关键核心技术攻关工程、中科院重点部署、上海市科技创新行动计划等重点项目,获批发明专利5项,合著专著1部,发表论文10余篇。
代表性论文
1. Lin, Z., Zhu, J., Huang, Q., Zhu, L*., Li, W., & Yu, W. (2024). Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments. Nanomaterials, 14(1), 127.
2. Wang, W., Zhu, J., Huang, Q., Zhu, L*., Wang, D., Li, W., & Yu, W. (2024). DFT Exploration of Metal Ion–Ligand Binding: Toward Rational Design of Chelating Agent in Semiconductor Manufacturing. Molecules, 29(2), 308.
3. He, Y., Li, X., Yang, J., Li, W., Li, G., Wu, T., ... & Zhu, L*. (2023). High-throughput screening giant bulk spin-split materials. Results in Physics, 49, 106490.
4. Jiang, W., Zhu, L., Chen, L., Yang, Y., Yu, X., Li, X., ... & Yu, W. (2023). In Situ Synchrotron XRD Characterization of Piezoelectric Al1−xScxN Thin Films for MEMS Applications. Materials, 16(5), 1781.
5. Yu, X., Zhu, L., Li, X., Zhao, J., Wu, T., Yu, W., & Li, W. (2023). Doping Engineering for Optimizing Piezoelectric and Elastic Performance of AlN. Materials, 16(5), 1778.
6. Wei, T., Liu, Y., Li, M., Zhu, L., Yu, W., Xue, Z., & Wei, X. (2023). Experimental and numerical analysis of wafer-to-wafer uniformity in double-sided polishing. Precision Engineering, 82, 383-391.