Electronic chemicals are specialized chemical materials specially designed for the manufacturing of electronic information products, and are important support materials for the electroplating, cleaning, etching, photolithography and other processes in the manufacturing of integrated circuits, and are high-tech products combining electronic materials and specialized chemicals. The electroplating process in wet process is an important deposition process for metal interconnect, which is characterized by bottom-up film deposition, and the void-free filling of metal interconnect can be realized by regulating the process conditions of electroplating and additive formulations.

Metal interconnect is an important part of integrated circuits, which connects independent transistor devices to realize integration. With the development of IC manufacturing technology towards small size technology nodes, the resistivity of copper interconnects is increasing rapidly because of the larger electron mean free range of copper, and the stronger electromobility of copper, which requires a thicker barrier layer to further increase the interconnect resistance. Therefore, there is a need to replace copper with cobalt interconnects and to develop supporting plating processes and materials.

Our research group focuses on developing electroplating solutions and additives for cobalt interconnect metallization at advanced integrated circuit technology nodes. The plating solution requires high cleanliness, so it is necessary to develop its purification and testing technology; the additive formulation involves a large number of organic molecules, which makes it difficult to mix, so it is necessary to study the mechanism of the effect of additives on the plating process. Meanwhile, metal interconnects need to use ALD process to deposit the barrier layer, and the precursor charging system is an important part to regulate the ALD process and ensure the stability of the ALD process, the research will focus on the design of the precursor charging system, combined with simulation and experimental testing, to improve the efficiency of the research and development of the new precursor charging system.

1. Research on purification technology of cobalt plating solution and development of detection technology of main components and impurities of plating solution;

2. Study the mechanism of adsorption of additive molecules on the electrode surface, the mechanism of influence on the kinetics of electrochemical reaction of metal ions, and the mechanism of influence on the morphology of metal plating filling in the channel;

3. Simulation combined with experiment, mutual iterative optimization, accelerate the development of new precursor filling system.