时间：2008年12月15日下午2：00－4：30
地点：5号楼307会议室
报告人：Madhavan Swaminathan教授(Georgia Institute of Technology)

报告题目：
System on Package – A New Paradigm for System Integration

Madhavan Swaminathan
Joseph M. Pettit Professor in Electronics
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, GA 30332 - 0250
Email: madhavan@ece.gatech.edu; URL: epsilon.ece.gatech.edu

As the semiconductor industry moves beyond the 45nm node and as systems become more heterogeneous, System on Chip (SoC) solutions are facing major barriers due to technical and business related reasons. This is leading to the development of new technological solutions such as System in Package (SiP) and System on Package (SoP). SoP, a technology being pioneered by Georgia Tech, allows for integration of functions in the package. Over the last decade Georgia Tech has focused on organic based technologies for integration. This focus is slowly beginning to shift towards silicon based packaging technologies that can lead to near monolithic integration capabilities along with providing better thermal management solutions
This talk will focus on embedded RF technologies in organic substrates that enable micro-miniaturization of systems including integration with digital electronics. Some of the topics covered in this talk will include Design, CAD and Test.

欢迎感兴趣的职工和同学前来参加！

第五研究室

Biography

Madhavan Swaminathan is the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering. He was the Deputy Director of the Microsystems Packaging Research Center, Georgia Tech from 2004 - 2008. He is the co-founder of Jacket Micro Devices, a leader in integrated RF modules and substrates for wireless applications. Prior to joining Georgia Tech, he was with IBM working on the packaging for supercomputers. He is the author of more than 300 journal and conference publications, holds 15 patents, and is the author of two books entitled “Power Integrity Modeling and Design for Semiconductors and Systems”, ISBN 0_13_615206_6. Prentice Hall, Nov 2007 and “Introduction to System on Package”, ISBN 978-0-07-145906-8, MCGraw Hill, Mar. 2008. He is an IEEE Fellow and has been recognized for his research through several awards including the 2007 Technical Excellence Award from the Semiconductor and Global Research Corporation (SRC/GRC). He received his M.S and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.